Online applications are invited for the Engineering Intern at Qualcomm. Check the eligibility and other details below!
About Qualcomm
Qualcomm is enabling a world where everyone and everything can be intelligently connected. You interact with products and technologies made possible by Qualcomm every day, including 5G-enabled smartphones that double as pro-level cameras and gaming devices, smarter vehicles and cities, and the technology behind the smart, connected factories that manufacture your latest purchase. Our robust connectivity solutions keep you connected—even in remote areas. Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning.
Job Summary
They believe that employees’ ideas change the world. For over three decades, we’ve been a global leader in mobile technology, continually pushing the boundaries of what’s possible. Working with customers across industries — from automotive to health care, from smart cities to robotics— we continue accelerating innovation and unlocking new possibilities in a time where everything is connected. By joining the Qualcomm family, you, too, can bring the future forward faster.
- SOC Validation & Debug
- SOC & Hard Macro Physical Design
- RF & Analog Layout
- RF/Analog/Mixed Signal/Power IC Design
- Low Power Design
- Board and FPGA Design
- Digital ASIC Design
- Design/SOC Verification
- CAD Solution Engineer
- Design for Test (DFT)
- CPU Design
Required Skill Sets
Must have educational background in one or more of the following areas:
Software Engineering Intern:
- Graduating in 2024
- Must be available for 2 or 6 months starting immediately
- Good understanding of OS concepts, Data structures, etc
- C/C++ and object oriented design
- Development of real-time embedded software and device drivers
- Mobile SW development for Windows Mobile, Android or Linux
- Linux/UNIX, Linux Drivers, Linux Kernel Development
Hardware Engineering Intern:
- Graduating in 2025
- Must be available for 11 months internship from July’24-June’25.
- Verifying SoC with embedded RISC/DSP processors, communications/ networking ASICs
- Verilog or VHDL, C/C++, Tcl/Perl/shell-scripting. RTL design experience and/or strong OO programming knowledge
- Knowledge of VLSI, wireless/wired communications and protocols or graphics/video multi-media
- Knowledge in PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout is required in RF/Analog/Mixed Signal IC Design
Qualifications
- Bachelor’s or Master’s Degree in Electrical Engineering, Computer Science Engineering, Communication Engineering, Electronics & Communications Engineering
- Graduating in 2024 or 2025
How to Apply?
Interested candidates can directly apply through this link.
Stipend
₹ 40,000 to ₹ 44,000
Note: Stipend information is taken from here!
Other Support
If you need accommodation during the application/hiring process, you may request one by emailing accommodation support.
Location
Bangalore, Karnataka.
Hyderabad , Telangana
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